Centre Clears 22 Electronics Manufacturing Projects, Unlocks ₹41,863 Cr Investment

The Ministry of Electronics and Information Technology (MeitY) has approved 22 new projects under the Electronics Components Manufacturing Scheme (ECMS), opening the door for investments totalling Rs 41,863 crore and an estimated production output of Rs 2.58 lakh crore.

Leading companies in the sector, including Dixon, Samsung Display Noida, Foxconn's Yuzhan Technology India, and Hindalco Industries, have had their proposals approved. These approvals come after a previous round of 24 projects that brought in Rs 12,704 crore.

Mobile manufacturing, telecom, consumer electronics, strategic electronics, automotive, and IT hardware are just a few of the 11 target product segments with cross-sectoral applications that make up the 22 approved projects.

Three of these deals with sub-assemblies, such as camera modules, display modules, and optical transceivers; three deals with supply chain items, such as aluminium extrusion, anode material, and laminates; and five concentrate on bare components, such as PCBs, capacitors, connectors, enclosures, and Li-ion cells.

The projects are distributed among eight states including Andhra Pradesh, Haryana, Karnataka, Madhya Pradesh, Maharashtra, Tamil Nadu, Uttar Pradesh, and Rajasthan.

It was also mentioned that global giants such as ARM, AMD, Qualcomm and others are now conducting their most advanced chip designs, including 2-nanometre nodes, in India, thus making the country a centre of excellence for advanced semiconductor design.

Under the restructured Design Linked Incentive (DLI) scheme, the government will support the most vulnerable early stages of chip design, but only after market validation. Funding beyond initial support will be aligned with private venture capital investment, ensuring public money is used only for commercially viable, globally competitive designs, in line with international best practices in the US, Taiwan, Japan and South Korea.

India is moving rapidly toward self-reliance across a wide range of electronic components including laminates and optical transceivers, enclosures, multi-layer PCBs, decimal cells, connectors, capacitors, and camera modules.

The country now has 298 universities where students are actively designing, taping out and validating semiconductor chips more than any other country in the world. In comparison, globally fewer than 20 universities offer end-to-end chip design and fabrication exposure.

Similarly, 100 Indian universities now host 5G labs, while AI development is being built on the same national talent-first model.